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TAS5828MEVM: PowerPAD connectoin

JDJ
Expert 3401 points
Part Number: TAS5828MEVM
Other Parts Discussed in Thread: TAS5828M

Hello, 

Do we have gerber files available for the TAS5828MEVM? If not, can you let us know the layer count? 

Also, the TAS5828M datasheet mentions that the top PowerPAD should be connected to ground for best performance.  The dev board has some screws that mount the heatsink to the PCB however they are non-plated pad so they are just floating.  Should the PowerPAD be connected to ground through the heatsink?

Thanks!

  • +1
    TI__Genius 14420 points

    Hello JDJ,

    This ground connection suggestion is not for device functionality. Whether the heatsink is grounded or not, the device can operate with normal functions and audio performance. It's only used for heat dissipation and no electrical function. 

    This ground connection we mention is for EMI consideration. If the heatsink is electrically floating, any noise at the device thermal pad would be coupled to the heatsink via parasitic capacitance which could result in a potential EMI problem since the heatsink would essentially act as an antenna.

    If you don't have much EMI concern then should be find to just connect the heatsink.

    I will send an email with the Gerbers

    best regards,

    Luis