Dear Sir,
We would like to verify layout for TPA3123D2 audio amplifier. so it should not fail in EMI-EMC etc. tests. also should work well in normal operating condition.
Regards
Yogesh
Hi Yogesh,
I reviewed the PCB layout picture and have the following comments:
1. The thermal pad is connected to GND plane by two very thin traces, then the thermal performance could be very bad. Please connect the thermal pad to GND sufficiently to let the heat go from the device to the GND plan. And don't forget to add some free VIA's to let the heat also flow from bottom to top layer. The following is a very good example.
2, The pin 8,9,13,14,23,24 are GND, please also connect them to the thermal pad. This can laso be seen in the above picture.
3. The output traces are too thin, because the output current could be high. Please use thicker trace for the output in PCB layout. And please also make sure the output routes are symmetry.
4. Reconstruction LC filter on the output should be placed as close to the output terminals as possible for the best EMI performance.
5. Please refer to our EVM design http://www.ti.com/lit/ug/slou208/slou208.pdf, which is a good example.
Best regards,
Shawn Zheng
