TPA3118D2-Q1: Thermal Simulation

Part Number: TPA3118D2-Q1
Other Parts Discussed in Thread: TPA3116D2-Q1

Team,

For TPA3118D2-Q1, is a thermal model available for thermal simulation? If not, what is the recommended approach for accurate 3D thermal modeling with airflow?

Thanks,

Phil

over 6 years ago

0 Adam Sidelsky over 6 years ago

TI__Guru 62390 points

Phil,

Which package are you interested in? DAD or DAP? I will need to request the thermal model.

Regards,

-Adam

0 pm over 6 years ago in reply to Adam Sidelsky

TI__Expert 6030 points

Hi Adam,

Thanks for the quick reply, and good to know we can request the model. Let me confirm the package, and I'll follow up.

Thanks,

Phil

0 Tomasz Taubert over 6 years ago in reply to pm

Prodigy 50 points

Hello TI Team,

Thanks for your help. Two questions:
1. Is the TPA3118D2-Q1 available both in the DAD and DAP package?
2. Actually, I would like to ask for thermal models of both the TPA3116D2-Q1 and TPA3118D2-Q1.

Thank you,

Tomasz

0 Adam Sidelsky over 6 years ago in reply to Tomasz Taubert

TI__Guru 62390 points

Tomasz,

The TPA3118 is available in DAP, TPA3116 is available in DAD.

I will request both and get back to you.

Regards,

-Adam

0 Tomasz Taubert over 6 years ago in reply to Adam Sidelsky

Prodigy 50 points

Thank you, Adam - looking forward.

0 Tomasz Taubert over 6 years ago in reply to Tomasz Taubert

Prodigy 50 points

Thanks, Adam - please let me know when you have something for me.

Tomasz

0 Tomasz Taubert over 6 years ago in reply to Tomasz Taubert

Prodigy 50 points

Hi Adam - as we are waiting for the thermal models, could you please address my original question to TI support on the thermal modeling of the TPA3118D2-Q1 for a 3D airflow/thermal simulation?

I know the external geometry of the part, and I have modeled it as solid single-material case with a thermal pad on the bottom; pins are not modeled. All the heat load is applied to the thermal pad. Is there a more accurate approach to 3D thermal modeling the TPA3118D2-Q1?

Thank you,

Tomasz

0 Shawn Zheng over 6 years ago in reply to Tomasz Taubert

TI__Mastermind 24835 points

Hi Tomasz,

Adam is out of office for travelling for now. He will get back to you soon later.

Best regards,

Shawn Zheng

0 Adam Sidelsky over 6 years ago in reply to Tomasz Taubert

TI__Guru 62390 points

Tomasz,

I am no model or thermal expert but the model we usually provide to our customers is the Delphi Thermal Model. I requested that and it is now ready for you. Can you use that?

Regards,

-Adam