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TPA6203A1: Dimensions of exposed thermal pad

Sadanori Kato
Guru 36510 points
Part Number: TPA6203A1

Hi,

For TPA6203A1DGNR, TPA6203D1 data sheet mentions the two types of exposed thermal pads dimensions(DGN0008D and DGN0008G) as follows.
So, could you please give me your advice about the following questions?

Q1.
Which of DGN0008D and DGN0008G is correct as the dimensions of the exposed thermal pad for TPA6203A1DGNR?

Q2.
If the dimensions of the thermal pad are different even in the same package due to the addition of an assembly site, please tell me the recommended land pattern that can be used in common.
Which land pattern is recommended, DGN0008D or DGN0008G?

Q3.
Could you please tell me the recommended specific values for the metal pad size which is mentioned in NOTE 9?

Best regards,
Kato

  • 0
    TI__Guru* 84915 points

    Hi, Kato-san,

    A1. DGN0008D is the correct package outline for this device.

    A2. Please use all the dimensions of the DGN0008D. 

    A3. The size of the metal pad varies only in creepage requirements. In this case, all the metal pad dimensions should be followed accordingly to the DGN0008D.

    Best regards,
    Luis Fernando Rodríguez S.

  • 0 in reply to Luis Fernando Rodriguez S.
    Guru 36510 points

    Hi Luis-san,

    Thank you for your prompt reply.

    For Q3, the size of 1.57mm x 1.89mm is recommended as the solder stencil opening if the stencil thickness is 0.125mm. So, please tell me the recommended metal size which is covered by the solder mask in this case.

    By the way, please tell me that reason why DGN0008G was added to the data sheet.

    Best regards,
    Kato

  • 0 in reply to Sadanori Kato
    Guru 36510 points

    Hi Luis-san,

    Our customer measured the dimensions of the exposed thermal pad dimensions and found that they match the DGN0008G package. So, I am so confused.
    Could you please confirm again on this issue?
    Additionally, is it possible to use a common board layout regardless of the dimensions of the exposed thermal pad? If possible, please provide me the detailed information.

    It would be very helpful if you would reply ASAP.

    Best regards,
    Kato

  • 0 in reply to Sadanori Kato
    TI__Guru* 84915 points

    Hi, Kato-san,

    Sorry for my late reply, we have been working on other urgent issues these days.

    It seems that both thermal pads are valid for this device. In this case, the customer is using the package associated to the DGN0008G package. Could you provide the part number that the device shows in the IC, please?

    Best regards,
    luis Fernando Rodríguez S.

  • 0 in reply to Luis Fernando Rodriguez S.
    Guru 36510 points

    Hi Luis-san,

    Thank you for your continuous support.

    I don't know whether DGN0008D or DGN0008G will be delivered, so I would recommend our customer to use DGN0008D as the land pattern in common.
    This issue has been closed, so I will contact you if I get additional questions from him.

    Best regards,
    Kato