For TPA6203A1DGNR, TPA6203D1 data sheet mentions the two types of exposed thermal pads dimensions(DGN0008D and DGN0008G) as follows.
So, could you please give me your advice about the following questions?
Which of DGN0008D and DGN0008G is correct as the dimensions of the exposed thermal pad for TPA6203A1DGNR?
If the dimensions of the thermal pad are different even in the same package due to the addition of an assembly site, please tell me the recommended land pattern that can be used in common.
Which land pattern is recommended, DGN0008D or DGN0008G?
Could you please tell me the recommended specific values for the metal pad size which is mentioned in NOTE 9?