TAS6422E Thermal pad connection.

Steen Hansen

Prodigy 20 points

According to the datasheet, the thermal pad should be connected to GND.

Is it a must or may the pad be unconnected?

Alternatively what is the recommended thermal gapfiller for this.

It is hard to find an electrically conductive gap filler.

Steen Hansen

over 3 years ago

0 Gregg Scott over 3 years ago

TI__Mastermind 36695 points

Hello Steen,

We know that it is difficult sometimes to get an electrical connection to ground. If this cannot be done, we need the heatsink is grounded to the ground plane very close to the device. So that a current loop on the ground is very short.

0 Steen Hansen over 3 years ago

Prodigy 20 points

Hi Gregg, thanks for your reply.

Sounds like I must find that gapfiller.

I can easily find a conductive grease, but I don't considder it safe to use, as I am afraid it might run to the pins creating shorts.

Steen Hansen

0 Gregg Scott over 3 years ago in reply to Steen Hansen

TI__Mastermind 36695 points

If you have this concern, use a standard non-conductive thermal interface material and provide a good ground for the heatsink near the device.

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TAS6422E Thermal pad connection.