Are the sides of the terminals solderable on this component? If so, where can I find this information.
If not, does TI have an option for this component with "wettable flanks"?
Thanks,
Jessie
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Are the sides of the terminals solderable on this component? If so, where can I find this information.
If not, does TI have an option for this component with "wettable flanks"?
Thanks,
Jessie
Under normal conditions and processes (stencil printing and reflow in air) these terminals do not seem to be forming a nice fillet on the side. I understand and see that these are exposed, but they appear to be copper.
If they are solderable, than what is different between these flanks and "wettable flanks".
Hi Jessie,
I think I understand now. So while these sides are exposed metal, they are not wettable flanks. This means that while you can get a fillet on the side of the device, it not always going to happen. It will vary based on the stencil size and device variance.
Wettable flanks feature a notch or grove cut from the edge of the pad that will enable visual inspection of the fillet. Note, the DAC7551 does not have these flanks.
https://forum.digikey.com/t/what-is-surface-mount-wettable-flank/3055
Thanks,
Paul