ADC124S021: Equivalent part but larger package required

Hi Phil,

Thanks for your question. What is the minimum pin-to-pin gap you are needing?

The 8-channel part in this device family has a slightly larger package size: https://www.ti.com/product/ADC128S022

Best,

Samiha

Hello Samiha,

The recommended land pattern for ADC128S022 still results in a pad spacing of 0.2mm - I need a package with minimum of 0.3mm spacing between solder pads.

Can you suggest anything which would be suitable?

Regards,

Phil.

Hi Phil,

I cannot find any with 0.3mm spacing. The closest I can find is the ADS7950 in VQFN package where the pads seem to be 0.26mm apart. If you have a specific device package in mind, please let me know.

Best,

Samiha

The part suggested may offer a slight improvement. To be clear, I am not looking for a package with exactly 0.3mm pad spacing, but a minimum.

Anything greater than 0.3mm will do.

Hi Phil,

I understand. The ADS7950 is the best I can find within devices similar to ADC124S021. If you have package types in mind, that would be helpful.

Best,
Samiha

Hello Samiha,

An SOIC or TSSOP package would work

Regards,
Phil.

Hi Phil,

It doesn't seem like we have any 4 input channel device that has such large pad spacing. This 1 channel part, ADC121S021, has a spacing of 0.45mm. There is also this 2 channel part, ADC122S021.

Out of curiosity, what is your project application? Also what copper weight are you using?

Best,

Samiha