ADC08D1020: SOLDER VOIDING

JERRY VAUGHN

Part Number: ADC08D1020

Can you please tell me what is the acceptable percentage of solder voiding for the center ground/thermal pad on this device.

0 jim s over 7 years ago

Jerry,

The soldermask clearance needs to be larger than the pad on the board, as a general rule of thumb. 110% would make the clearance a little larger.

Regards,

Jim

0 Jim Brinkhurst1 over 7 years ago in reply to jim s

Hi Jerry

Thermal vias in the pad area should be filled and un-masked to minimize voiding.

Overall void percentage should be less than 50% of the device thermal pad area.

Best regards,

Jim B

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