Hello,
I am investigating the maximum surface temperature of the IC with respect to the solder bonding ratio of the Power PAD.
I know that a solder joint ratio of 50% or more is recommended, but I would like to know the maximum surface temperature when the solder joint ratio is less than that.
Specifically, I would like to know the temperature when the solder bonding ratio is 20% on a 6-layer board.
So I have a question.
Is there a Power PAD solder coverage vs. θja thermal modeling graph on a 6-layer board?
Also, if the solder coverage of Power PAD on a 6-layer board is 20%, what percentage will the deterioration rate of θja from 100% be?
The calculation formula used is as follows.
Tc = Ta + (θja-θjc) x (deterioration rate) x Pd (max)
M.UEDA.
