Tool/software:
What is the pressure limit for this part? I am looking to top cool this part with a thermal interface material to a cold plate.
Thanks!
Hi Eric,
I would be applying around 25-30psi of pressure to this component.
Thanks!
Matt
Hi Matt,
I have reached out to our internal packaging team to see if this would be okay - I am hoping to get an answer within 24 hours but it may not be until the end of the week.
I will keep you updated.
Best,
Parker Dodson
Hi Matt,
So I got some information back from our packaging team - we don't characterize this data for this device (and it sounded like we don't do it for any of our packages). They said they may have a relevant case study - but I don't know what that entails. When I receive that information I will let you know, but we don't give any specific pressure limit on this device.
Best,
Parker Dodson
Hi Matt,
Sorry for so many back to back replies - while we don't characterize the parameter directly my packaging team gave a general guidance of no more than 20N.
20N / 9mm^2 (area of package)--> ~322psi. So while the reference material is on a QFN and not a DRC - they are the most similar to each other. Since the general guidance limit is well above the 25 to 30 psi you want - I think there isn't a lot of risk to go ahead and use because that should be a relatively safe level. I do want to stress that we don't characterize or specify a specific limit on this device, but from our best information available the risk should be pretty low at those pressures.
Best,
Parker Dodson