THVD2450V: Pressure Limit

Part Number: THVD2450V

Tool/software:

What is the pressure limit for this part? I am looking to top cool this part with a thermal interface material to a cold plate.

Thanks!

  • Matt,

    I'm not sure if we have this information specifically, but we can check with some internal teams to see what's available. Can you share the expected weight/pressure from the cold plate?

    Regards,

    Eric Hackett 

  • Hi Eric,

    I would be applying around 25-30psi of pressure to this component. 

    Thanks!
    Matt

  • Hi Matt,

    I have reached out to our internal packaging team to see if this would be okay - I am hoping to get an answer within 24 hours but it may not be until the end of the week. 

    I will keep you updated. 

    Best,

    Parker Dodson

  • Hi Matt,

    So I got some information back from our packaging team - we don't characterize this data for this device (and it sounded like we don't do it for any of our packages). They said they may have a relevant case study - but I don't know what that entails. When I receive that information I will let you know, but we don't give any specific pressure limit on this device. 

    Best,

    Parker Dodson

  • Hi Matt,

    Sorry for so many back to back replies - while we don't characterize the parameter directly my packaging team gave  a general guidance of no more than 20N. 

    20N / 9mm^2 (area of package)--> ~322psi. So while the reference material is on a QFN and not a DRC - they are the most similar to each other. Since the general guidance limit is well above the 25 to 30 psi you want - I think there isn't a lot of risk to go ahead and use because that should be a relatively safe level. I do want to stress that we don't characterize or specify a specific limit on this device, but from our best information available the risk should be pretty low at those pressures. 

    Best,

    Parker Dodson