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TMDSEMU200-U: facing challenges while flashing the device using the XDS200USB

Part Number: TMDSEMU200-U

problem is below:-We are facing challenges while flashing the device using the XDS200USB. During debugging, we observed that the VREF voltage (~3.3 V) is present between Pin 4 (VREF) and Pins 8, 10, and 12 (GND). However, as per the 14 pin female socket header pinout, Pin 5 is specified as the VREF pin. This mismatch between the observed behaviour and the documented pinout is causing confusion and is currently blocking the flashing process.XDS200 DEBUG Connector.docx  

  • Hello,

    I can confirm that pin 5 on the TI 14-pin connection is VREF (VTREF, PD, TVD, etc.). I'm not familiar with the XDS200 internal implementation since it is a Blackhawk product, but Pin 4 is used for TDIS (target disconnect) and should be connected to GND. The 20-pin cTI to 14-pin TI pin converter may have a short between pin 4 and VREF; please confirm if this is the case.

    Best,
    Matt

  • Hi Matt , 

    We measured pin 4 of the 14‑pin connector on the XDS200 debugger and observed a voltage of 3.3 V. We verified that there is no short between pin 4 and Vref.

    This behavior is consistent across two different XDS200 debuggers, so it does not appear to be a unit‑specific issue.

    For this measurement, the debugger is not connected to our target hardware. We are only connecting the USB cable to the debugger (for power) and then measuring the voltage at the connector pin.

    Given this setup, we would like to confirm whether this behavior is expected, or if we might be missing something in our understanding or measurement approach.

    Could you please advise on this and let us know if any additional checks or conditions are required?

    Thanks in advance for your support.

  • Hello,

    For this measurement, the debugger is not connected to our target hardware. We are only connecting the USB cable to the debugger (for power) and then measuring the voltage at the connector pin.

    Disclaimer: I'm not familiar with Blackhawk's XDS200 implementation, but for TI's XDS110:

    TDIS is internally pulled-up 3v3. The expectation is that once the probe is connected to the target, the target's GND will overdrive the pull-up and keep the TDIS pin low. This tells the XDS that it is currently connected to the target. Once the probe is disconnected, TDIS will be pulled up to 3v3 again, severing the JTAG connection.

    Could you please advise on this and let us know if any additional checks or conditions are required?

    Can you provide more details on the JTAG connection error? What is the particular error code? Does the Test Connection in the ccxml pass?

    Best,
    Matt

  • Hello,

    Given this issue is occurring on an MSPM0L device, I'm going to loop in the MSP product line for better support.

    Best,

    Matt

  • Hi Vineet,
    Let me consult internally with my team if we the XDS200 has any support for the MSPM0 (it seems firmware compatibility will be need it to be able to program the device.)

    Best Regards,

    Diego Abad