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TL16C550D: VQFN-32 Thermal Pad

Part Number: TL16C550D


I have a question regarding the TL16C550DIRHB (VQFN-32).

Should we connect the thermal pad to the digital GND.


  • Hi Dany,

    It is generally recommended to connect the thermal pad to ground in order to aid in thermal conduction, but it is not required for the device to function (the VSS pin is the primary ground connection).

  • Hi Dany,

    I agree with Max, you can connect this thermal pad to ground in order to aid thermal conduction. this thermal pad is designed to be attached directly to an external heatsink. The thermal pad must be soldered directly to the printed circuit board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane or alternatively, can attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit.