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DS25BR150: Looking for a LVDS buffer that support Hot Swap

Rocky Chen
Expert 7115 points
Part Number: DS25BR150
Other Parts Discussed in Thread: DS25BR120, DS25BR100, , DS25BR110, DS90LV004, DS15MB200, DS25BR440

Dears,

I am looking for a LVDS buffer that support Hot Swap. But can not find a direct solution. Can you please comment and suggest?

My user case is: rate 1.25G, cable length 5m.

Thanks!

  • 0
    TI__Mastermind 43795 points

    Hi Rocky,

    The DS25BR150 (or DS25BR100, DS25BR110, DS25BR120) can support a hot swap environment.  I would look to add ESD protection devices on the hot swap connection side to ensure a path to GND/VDD for any charge present at the time of connection.  ESD protection for USB3.0 will have low capacitance so the 1.25 Gbps signals are not compromised.

    Regards,

    Lee

  • 0 in reply to Lee Sledjeski
    TI__Expert 7115 points

    Hi Lee

    Is there any certification report or anything that can demonstrate that these devices can support hot swap? I can not find any information in datasheet.

    Thanks a lot for your help.

    Best Regards

    Rocky

  • 0 in reply to Rocky Chen
    TI__Mastermind 43795 points

    The datasheet shows the inputs are high impedance under the following conditions.

    Normally for hot insertion events the GND and VCC supplies are connected prior to any signal connection.  Based on the supply connection prior to any signal connection the DS25BR110 would be high impedance and not exceed any datasheet parameters.

    Regards,

    Lee

  • 0 in reply to Lee Sledjeski
    TI__Expert 7115 points
    Hi Lee,
    I have few questions:
    1, Do you mean the this device's hot swap function works in condition of the VCC come prior to hot insertion?
    2, Is there a 4 Channel buffer?
    3, If the DS90LV004 have same feature with DS25BR120/ DS25BR110, in perspective of hot plug?
    4, DS15MB200 have hot plug protection feature that said in datasheet, is this buffer also need GND and VCC supplies prior in connector?

    Thanks!
  • 0 in reply to Rocky Chen
    TI__Mastermind 43795 points

    Hi Rocky,

    With any hot swap condition it is very important to connect at least the GND of both system elements together prior to connecting the signals.  If there is no connection of VDD and GND any charge or voltage difference present at the time of connection finds its way into the device and may not be shunted away from sensitive parts of the design.

    The 4-channel equivalent is the DS25BR440.

    The DS90LV004 has a similar set of electrical constraints.

    Yes, the DS15MB200 also assumes that GND/VDD will connect prior to signals.

    Regards,

    Lee