AM26LV32E-EP: Junction to case thermal resistance

Michael,

We will have to get the datasheet updated with current thermal metrics.

However, in the mean time you can use the industrial versions with same package for the thermal metrics.

For Theta Jc top, it is 38.4 for the D package.

If this answers your question, please click "Verify it as the answer"
Regards,
Wade

Wade,

I am trying to determine the thermal response of this part at the junction without top cooling; therefore, my interest is more with the Theta JC bottom so that I can calculate the resistance to (and ultimately through) the pins.

Thank you,
Mike

Michael,
I don't think our modelling team is working on this request until they hear back from you on how you intend on using this data. This question was asked in the other post here: e2e.ti.com/.../727356
How are you mounting devices to board? Is there an air gap?
Please update on proposed usage, and we will see if the modelling team will agree with how you propose to use the data. They are concerned that the metric is not being used properly, as it is intended to be used only on devices with thermal pads (a direct thermal connection to the board).
Regards,
Wade