Hi All,
Regarding the TCAN1042HV-Q1 customer chose the VSON8 package.
I realized that this package also has the thermal PAD which, as the datasheet suggests, must be soldered on the PCB in order to guarantee the correct thermal dissipation of the component.
Could you also let me know if it is useful to connect the thermal PAD to GND or if it should be left floating (soldering it, as already said, on the PCB)?
Many Thanks,
Antonio