TLK2711EVM-CVAL: PCB guidelines for creating the TLK2711 part

Hi,

Please refer to Section 11 (Layout) on the datasheet for guidelines.

www.ti.com/.../tlk2711-sp.pdf

Cordially,

Rodrigo Natal

HSSC Applications Engineer

Hi 

Thank you.

I have already gone through that. But there is no mention about dimension details about IC/pins which is required to create the Part in our database.  

Page 28 on the datasheet has the package drawing for this High-Performance 68-Pin Ceramic Quad Flat Pack Package (HFG) device, including the dimensions.

Cordially,

Rodrigo Natal

HSSC Applications Engineer

Hi,

The details in the page no 28 is about IC with mechanical package if i am not wrong. If you see the page 28 of datasheet, the middle part of the package is the IC. I think the pins of the IC (Only IC) can be length adjustable. Required this pin information.