SN74LVCC3245A-EP: About the difference of SN74LVCC3245A-EP

The Enhanced Product Selection Guide says:

Our enhanced products portfolio mitigates the risks that the avionics and defense markets face with COTS integrated circuits (ICs) by:

• Using the latest and most robust plastic encapsulation methodology to support the harsh environment needs.
• Ensuring tin plating content is not above 97% to eliminate the risks related to time-dependent pin-to-pin metal shorts (aka tin whiskers) by assembling the device with NiPdAu plating or SnPb solder balls.
• Using only gold (Au) bond wires to ensure the highest quality die to leadframe connection.
• Performing extended 250 hours highly accelerated temperature and humidity stress testing (HAST) to demonstrate improved moisture resistance, extending both operational life and dormant storage capabilities.
• Extending temperature ranges from -55°C to 125°C to enable the broadest possible use cases.
• Ensuring a single controlled manufacturing baseline flow with a single wafer fab, assembly site and test site to ensure the applicability of customer’s qualification even over multi-decade programs.
• Ensuring orderable (V62/xxxx) DLA vendor items drawings part numbers that eliminate the need specification source controlled drawings.