Other Parts Discussed in Thread: TMUX1111
Hi Team,
Can you please help us with this concern of our customer.
Regarding the differences in Recommended layout diagram for the following parts :
The parts are available in 16 PIN QFN . Datasheets attached for your reference.
SN74AVC4T774RSV (Jan 2015)
TMUX1112RSV (Aug 2019)
Issue :
Layout recommendation for SN74AVC4T774RSV , where lead span is 1.55x2.35
Layout recommendation for TMUX1112RSV, where lead span is 1.60x2.40
Do you recommend to update the footprint to lead span of 1.60x2.40 for all the similar package parts that are in our library ??
Layout engineers here feel to increase this pitch to avoid short between corner pins and avoid solder bridge issues… What your thoughts on this ?
I noticed that the latest datasheet of SN74AVC4T774RSV recommended the RSV0016A footprint as shown at page 34 in the link below. This update is not included in the revision history of the datasheet. Our customer would like to know if there was a PCN issued on this change.
https://www.ti.com/lit/ds/symlink/sn74avc4t774.pdf#page=34
Regards,
Danilo