Hi Team,
My customer would like to know about the SN74AXC1T45QDRYRQ1 standoff information. I checked the datasheet and found out that this device is SON (DRY) package, can confirm the minimum standoff of this device?
Can I easily say the standoff height is 0? Also, because the pins do not protrude from the IC and the bottom of the IC is flat, coplanarity is also 0?
Is the JEDEC standard values 0.05mm maximum standoff and 0.08mm coplanarity which is applicable to WQFN/SON packages, can be applied to this device since this is SON package? can you confirm the minimum standoff?
Thank you for your support.
Renan
