TMDSEMU200-U: Download abnormal TMDSEMU200 -u

Hi Haifei,

Do you always get the above error message when connecting to the debug probe through uniflash? Did you use uniflash with the TMS320F28075 device as well?

haifei su said:

Burning device in use after a period of time will not be able to use

Are you saying that after a period of time the device is no longer functioning as expected or you can no longer connect to the device? Is this true for the TMS320F28075?

Are you connecting to the device under ambient temperature or high temperatures? 

Best Regards,

Marlyn

Yes.


We use the old version XDS200 stability is much higher (but not available), TI factory technicians were tested with the mimic board, to confirm the connection problem, let me on the BBS for help

我们的连接,探针是好的,在室温下运行

Our connection, probe is good, is running at room temperature

Hi Haifei,

Thank you. I have assigned your question to another team who will be able to continue to help. 

Best Regards,

Marlyn

Excuse me the follow-up whether still in the position to reply?

haifei su said:

to reproduce the problem

The error indicated here is related to a communication issue between UniFlash and the debug probe. It is typically unrelated to the target board itself.

Can you confirm that the SAME PC with the SAME XDS200 probe and SAME UniFlash software has no problem with F28075 and the issue is only with TM4C1292?

What is the vendor of the XDS200 probe? Blackhawk?

Thanks

ki

Thimble test using the ingun, we can confirm the fixture and thimble without problems, because use the last version of the simulator XDS200 are norma

My question is more about if the same XDS200 debug probe, UniFlash, and PC work fine with F28075 but fail with TM4C. Basically if you swap the TM4C board with F28075, everything works fine?

Firstly, when put into use this emulator is good, use after a period of time will appear unstable and the connection is not on the phenomenon, and then back to Shanghai TI corporation technical staff analysis, they used the analog board verification, appeared only in 28075, the rest of the chip are connected on the phenomenon, don't let us to seek help in the BBS, the simulator can be used with poor stability, we want to return

If I understood correctly - the emulator used to work fine with TM4C but after some time the issue appeared. The emulator was then sent back to TI Shanghai office for analysis and they tested with F28075, where it worked there. Did I understand correctly?

In any case, the root issue I can see is the PC to emulator communication. 

Also, you mentioned something about older XDS200 and newer XDS200 versions, saying that the older version was more stable. Are the vendors for both older and newer also Spectrum Digital?

yes.

Shanghai TI headquarters technical analysis result is that the new version of the XDS200 exists on the connection problem, then let me post in this paper.
We are all in the river on purchase of core city, old and new version, new burning apparatus manufacturing Shanghai TI reply is a third party.

If the issue only occurs with the newer debug probe then it is likely a defect with that newer probe. You may want to contact the seller and look to get a replacement.

Replacement of the same model of the material or need to replace other products?

A replacement of the entire XDS200 debug probe itself.