MSP430F2274-EP: Thermal Characteristics

Hi kevin,

Thanks for posting the thread to MSP low-power microcontroller forum.

I have gone through the datasheet, acutually it doesn't describe Thermal Characteristics you need. But, you can refer "Operating free-air temperature range" to the "Max Junction Temperature", it not exactly the same, but similar.

If you are concerned about other thermal characteristics, please check the package information:

Here is the link: https://www.ti.com/support-packaging/SMT-application-notes.html#qfn 

Meanwhile, if you want to ask more specific detail information, please give me some clarification about the following question:

What is you trying to achieve or why this information is needed - what is your application and why you are asking about thermal data? Our team says that typically this thermal data isn't that useful on a low power device which is why it's not always in the datasheet as you found. Is there a particular mission profile the you have that can be provided?

If the information is not suitable for public, please send it to me via email: sal-ye@ti.com. And, if it really neccessary, then I will ask relevant experts for the data. It will cost much time to get it.

As for other three devices, please check the datasheet  of them or find the right forum to post the thread.

Thanks.

B.R.

Sal