Hi,
I need the pad placement/package size information as well as any handling/process information available for the MSP430F5438ACY - it should be a die package.
There's another post which says that the package information is at ZCA0113A ZCA (S-PBGA-N113) 4225149 (Rev. A) (ti.com) BUT this is the NFBGA and not the bare die. I believe the bare die is available as a part and that's what I'm looking for. If this isn't available as a die package, I'm interested in learning what is in the MSP family with a decent amount of flash like this one.
Where can I download the die information (bond pad sizes/locations, die size, etc)? Thanks!
