Yes Thank you.I work for L3Harris in Clifton NJ and L3Harris would like to use a TI M430FR5739SRHATEP for a space customer in a space application. One of the requirement sis to meet Outgassing per ASTM E595.Mold encapsulation compound is described as “Sum EME-G770HCD”. What is the difference between “G770HCD” & “G770”, and will the “G770HCD” meet outgas limit requirements?
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