Part Number: MSP430FR2532
Tool/software:
Dear TI,
We performed ESD testing on the communication pins (SMBUS SDA/SCL)under the following conditions: 0.2 kV, 0.05 s/pulse, 40 times per cycle.
The results confirmed that the ESD impacted the MCU.
Using the same code compiled with both IAR and CCS,
we found that the CCS-compiled version triggered __TI_ISR_TRAP after ESD strikes,
causing the program to enter the WDT and reset the MCU.
In contrast, the IAR-compiled version did not exhibit this issue under the same ESD conditions.
We would like to ask:
Could this phenomenon be related to the CCS compiler?
Is it possible that ESD causes the program to enable unknown or unintended interrupts?
Could it be that the way we defined the interrupts is incorrect?

(From what I see in the .map file, it looks like all the interrupts are declared.)
We observed that the customer's printer may apply 5V to 10V pulses (approx. 200 ns) to the communication lines (SDA/SCL),which causes brief fluctuations on Vcc.
Could this kind of ultra-short overvoltage impact the MCU’s operation?
Do you think it is necessary to implement additional hardware protection for such transients?
We look forward to your expert opinion. Thank you!!
Eric Shieh










