Our application using MSP430 series, will be very low power scheme for a sensor. Do we still have to use the exposed solder?
In low volume manufacture, it is always fraught with poor solder underneath a part. Is it just for heat sinking? It is not used a common ground?
Is there a similar size but square pkg with gull wings but no exposed solder pad? SOIC is too big for this product.
thnx