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MSP430AFE221: MSP430

Part Number: MSP430AFE221

Our application using MSP430 series, will be very low power scheme for a sensor. Do we still have to use the exposed solder?

In low volume manufacture, it is always fraught with  poor solder underneath a part. Is it just for heat sinking? It is not used  a common ground?

Is there a similar size but square pkg with  gull wings but no exposed solder pad? SOIC is too big for this product.

thnx

  • Hi Robin,

    is it possible that you're not looking at the MSP430AFE221? I've looked at the datasheet and it's only in a TSSOP package. Have you been looking at a different device?

    In case you're looking for a specific package to use, you could try out the Products tab on the Microcontrollers web page and filter for whatever package group is needed. Please note though that we don't provide all package variants for every MSP430 device.

    Best regards,

    Britta

  • Hi Robin,

    as I didn't hear back from you I assume that the issue has been solved on your end.
    Please note that I'm closing this thread but that replying back to it will re-open it if needed.

    Best regards,
    Britta