DRV8212: Thermal Profile

But it has higher Junction to Board resistance (assuming includes the thermal solder pad under the case) of 42.6 vs 25.8, then how is the WSON better?

Also, it has higher junction to case (top) but has lower junction to ambient. How is this possible?

Brian

Is the Rja higher for DRL since the pins are directly exposed to the ambient environment? Ie the Rjb / Rjc being higher will result in more heat being moved off of the device to the board and the box heating up more than the ambient environment in comparison to the DRL, right Ryan Kehr?

Cameron,

There is a good app note that describes how all these measurements are done.  

https://www.ti.com/lit/an/spra953c/spra953c.pdf

https://www.ti.com/lit/an/slma002h/slma002h.pdf - PowerPad specific

For a PowerPad package, Theta JC (bot) is more relevant as the majority of the heat flows thru the PP and not the leads of the IC.  

Regards,

Ryan

Is there a reason we don't have Theta JC (Bot) in the datasheet in that case? Is that something we test in qualifications? 

I realize it is just below all the other characteristics...my bad