DRV8426: Thermal PAD

Masakazu Adachi

Part Number: DRV8426

Hello team

I have a question.

Is there a risk of nFault output due to the thermal pad not being connected to ground?
My customer made a mistake in pattern design and tested with the thermal pad not connected to GND, and nFault was output even though the top of the IC was about 60℃. After that, when the thermal pad was connected to ground, the issue was resolved.

Regards,

Masakazu Adachi

3 months ago

+1 Jacob Thompson 3 months ago

TI__Mastermind 21720 points

Hey Adachi-san,

Yes, this could happen. Thermal pad not being connected to GND can often result in erroneous or "fake" OCP detection or TSD (Thermal shutdown) detection, causing the device to trip when it normally wouldn't have. So yes, I think reasonable that this was causing the nFAULT issue here.

Best,

Jacob

0 Masakazu Adachi 3 months ago in reply to Jacob Thompson

TI__Intellectual 2500 points

Hello Jacob-san,

Understood. Thanks for the support.

Regards,

Masakazu Adachi

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DRV8426: Thermal PAD