Tool/software:
Hello team,
The example board layout of VQFN package shows that no thermal vias at the corners of the thermal pad.
Is there any reason you don't place vias at the corners?
Many of ther device has no thermal vias at the corner of thermal pad as well.
Best Regards,
Kei Kuwahara
Hello Kuwahara-san,
See below the thermal vias in our DRV8434SEVM. Cannot think of reason why we can't use corner thermal vias for this particular device package.
The land pattern you highlighted in an example. We also have another example in the datasheet.
The Altium project for our EVM can be downloaded from the EVM webpage. Customer can reuse our layout and thermal vias if they'd like to. Thank you.
Regards, Murugavel
