LM61495-Q1: LM61495-Q1technical support

Hi Zhonghui,

I would suggest ordering a LM61495EVM to test the operation and functionality of the device to your desired application.

Since this device does not have a die-attached pad (DAP) for thermal dissipation, most of the heat will flow out of the package through the pins and onto the board. As a result the device will heat up the more the output power is. 

In theory the basic operation of this device should be able to perform 19Vin|12Vout|10A given that there is enough copper area to prevent the internal junction temperature from hitting thermal shutdown.

For high output power applications, it is always recommended to operate at lower switching frequencies (ie. 400kHz) since lower frequencies have better power conversion efficiency and lower power dissipation which will result in better thermal performance. 

Again I would advise that you take an EVM and test our your condition. However I would suggest operating only at room ambient temperature (25degC) with that kind of output power application. I worry that any hotter might result in the device's internal RDson becoming more resistive at higher temperatures, resulting in more power dissipation and higher thermal reading.

Regards,

Jimmy