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LMZ14203H: Internal Construction Question for Solder Reflow Profile

Steve Widener
Genius 9805 points
Part Number: LMZ14203H

For the LMZ14203HTZ/NOPB component, we have a few questions in terms of the thermal profile of this component. In the datasheet and in SNAA214, it specifies the reflow profile for the LMZ1 and LMZ2 components, as well as the max peak temperature. We would like to know what temp solder, or what kind of solder is used internal of the module, if any components are staked or glued, and what could happen above the peak temp listed on the LMZ14203HTZ/NOPB.

  • 0
    TI__Mastermind 30430 points

    Hello Steve, 

    I need to understand a bit more on this request.

    First, based on the line of questioning, I would have to assume that the customer is having some manufacturing issues with our reflow profile?

    If not, how do they intend to use this information, as the reflow profile supplied should provide high yield and is the approved and proven-out method? The information requested is not typically requested by our end-customers.

    I am assuming the reason for asking is good, but I need more information before supplying restricted info, as well, knowledge of the customer and their NDA status.