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Hi team
As the SoC power supply needs grow, customer need more large current DCDC for Vcore power supply, as they never use those device before and TV PCB is a 2 layer 1Oz low cost design, they have concern on the thermal performance of large current part in their PCB.
Do we have some guideline for the thermal design and estimate method which can be shared with customer?
Thank you
Best regards
Joe
24 AUG
Hello Joe,
There is a PCB layout example in the datasheet that the customer can follow in Section 9.5.2. Layout guidelines and power considerations are detailed in Section 9.5.1.
The LMR51450 EVM is using a 4 layer 2oz copper on top and bottom and 1oz cooper for inner mid layers. You can simulate on WEBENCH designer tool first which assumes you are assume that a 2 layer 1oz low cost design would have worst thermal performance from there.
For a 2 layer design for high current, the customer should be mindful of having as much unbroken ground plane for heat dissipation.
Regards,
Jimmy