TPS7A57: FloTHERM model for TPS7A5701RTER

Takayuki Endo

Part Number: TPS7A57

I am using Simcenter Flotherm 2210. Could you please provide a .pdml or .pack file? Please use a format that can be read by Ver.2210.

7 months ago

0 Takayuki Endo 7 months ago

Prodigy 10 points

When I contacted the customer center via chat, they told me to request it on this forum.

CS2132391

0 Josh Nachassi 7 months ago in reply to Takayuki Endo

TI__Expert 5231 points

Dear Takayuki,

Let me see what I can do for you. Please give me some time.

Thank you,

Josh Nachassi

0 Josh Nachassi 7 months ago in reply to Josh Nachassi

TI__Expert 5231 points

Dear Takayuki,

I tried to message our thermal engineer, but he is out of office already for the holidays. I will get back with a response after the holidays.

Thank you,

Josh Nachassi

0 Stephen Ziel 6 months ago in reply to Josh Nachassi

TI__Mastermind 32600 points

Hi Takayuki

I've submitted a thermal request. Our typical lead time is 2-3 weeks. I'll let you know when I have an update.

Thanks,

Stephen

0 Takayuki Endo 6 months ago in reply to Stephen Ziel

Prodigy 10 points

Thank you very much for your response. Could you provide the file?

0 Stephen Ziel 6 months ago in reply to Takayuki Endo

TI__Mastermind 32600 points

Hi Takayuki,

I've sent a message to the thermal engineering team and I'll let you know when I have an update.

Thanks,

Stephen

0 Stephen Ziel 6 months ago in reply to Stephen Ziel

TI__Mastermind 32600 points

Hi Takayuki,

We expect to have your model by the end of the week.

Thanks,

Stephen

0 Stephen Ziel 6 months ago in reply to Stephen Ziel

TI__Mastermind 32600 points

Hi Takayuki,

Please find the model attached to this thread.

Thanks,

Stephen
TPS7A57_DELPHI_CTM.pdml

0 Takayuki Endo 6 months ago in reply to Stephen Ziel

Prodigy 10 points

thank you. I will try the model you provided.

0 Stephen Ziel 6 months ago in reply to Takayuki Endo

TI__Mastermind 32600 points

Hi Takayuki,

Let us know if you need anything else.

Thanks,

Stephen

0 Takayuki Endo 5 months ago in reply to Stephen Ziel

Prodigy 10 points

Thank you for providing the simulation model. We are currently proceeding with verification using the simulation model you provided. In order to confirm operation in our environment, we are trying to confirm the reproducibility of 6.4 Thermal Information Values (page.5) listed in the TPS7A57 data sheet.

Could you please provide the following information to the extent possible?

Regarding the JEDEC standard (2s2p) board.

・ Is the substrate size 76.20 mm x 114.30 mm x 1.6 mm?

・ Is the trace area for all trace layers 74.2 mm², located 1 mm inside from the edge of the substrate?

・ Are the thicknesses of the trace layers 70 μm for the outer layers (layers 1 and 4) and 35 μm for the inner layers (layers 2 and 3)?

・ Are the spacings between the trace layers (between layers 1-2, 2-3, and 3-4) uniform?

・ Could you please provide the trace data for the substrate, or any related information? If that is difficult, could you provide the copper foil percentages for each trace layer?

・ Are the die pad exposed areas solder-connected to the substrate? If vias are present, please provide the via specifications (arrangement (number and pitch), diameter, plating thickness, and connected trace layers, etc.).

・ Was the mounting substrate used for all thermal parameters (RθJA, RθJC(top), RθJB, ψJT, ψJB, RθJC(bot)) measured with the same specifications according to the JEDEC standard (2s2p)?

・ Under what conditions was the thermal parameter RθJC(bot) measured?