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Original question:

TPS1H200A-Q1: Leakage current of /FAULT pin

TPS1H200A-Q1: Confirmation of risk of device deterioration for thermal shutdown in HOLD MODE

MESH
Intellectual 840 points
Part Number: TPS1H200A-Q1

Hello,

I am designing the circuit used TPS1H200A-Q1.

This TPS1H200A-Q1 is planned to be used in HOLD MODE.

When used in HOLD MODE, if the output current becomes larger than the current setting value, it will be clamped at the setting value and current output will continue.

If the junction temperature exceeds 175℃ due to continuous current output, a thermal shutdown will occur in the TPS1H200A-Q1.

Is there a risk that the TPS1H200A-Q1 will deteriorate if thermal shutdown occurs repeatedly?

I will be using TPS1H200A-Q1 with heat countermeasures by adding heat dissipation fins and heat dissipation patterns, but please be sure to confirm whether there is any risk of deterioration.

Regards,

MESH

  • +1
    TI__Mastermind 32650 points

    Hi MESH,

    We do provide FIT rate data for this device which helps give the user the confidence of performance over lifetime.

    For thermals, the device protects itself from operating outside the SOA with the help of the thermal shutdown and thermal swing.

    The device is rated to AECQ100-12 specifications and therefore has experiences 1M cycles of short to GND testing for both cold and hot pulses and is confirmed to operate as expected after such tests. You can find the test result for this device here: 

    https://www.ti.com/lit/an/slva709a/slva709a.pdf

    Please make sure when designing with the device to stick to the schematic and layout recommendations to ensure good thermal performance.

    Thanks,

    Shreyas

  • 0 in reply to Shreyas Dmello
    Intellectual 840 points

    Hi Shreyas,

    Thank you for your reply.

    I check document of slva709a.

    Your reply is very helpful for me.

    Regards,

    MESH