TPS709: Thermal Pad Left Floating

Keith Keller

Part Number: TPS709

Hello,

For the TPS70933DRVR, would there be any sort of issue if the extra ground pad underneath the IC (for the DRV variant) were not connected to ground even if pin 3 (GND) is connected to GND?

Wondering if this would cause any performance issues? The data sheet only suggests a change in thermal performance.

Thank you, Keith

5 months ago

0 Juliette 5 months ago

TI__Mastermind 18466 points

Hey Keith,

Because the datasheet says that it is internally connected to GND, an internal node on the IC is likely using the GND pad as a GND connection instead of PIN 3.

The second sentence on the datasheet is adding unnecessary confusion and we will update that, thank you for pointing it out.

Best,

Juliette

0 Keith Keller 5 months ago in reply to Juliette

TI__Expert 6530 points

Hi Juliette,

So you're saying that the Thermal Pad must be connected to ground along with Pin 3?

Thank you, Keith

0 Juliette 5 months ago in reply to Keith Keller

TI__Mastermind 18466 points

Hey Keith,

yes

Best,

Juliette

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TPS709: Thermal Pad Left Floating