TPS54160A: New DGQ package

Hirotsugu Kobayashi

Part Number: TPS54160A

Tool/software:

Hi team,

A new DGQ package has been added, but the PAD dimensions are different.
Would it be appropriate to make the opening 1.75x1.89mm so that it can accommodate either package?
Is it possible to specify either package when purchasing?

Best regards,

21 days ago

0 Nityanand Hegde 20 days ago

TI__Intellectual 1060 points

Hi Hirotsugu-san,

Regarding this query, please check with customer service team. They should be able to help you.

Thanks,

Nitya

0 Hirotsugu Kobayashi 20 days ago in reply to Nityanand Hegde

Mastermind 8645 points

What about the size of the opening?

0 Nityanand Hegde 20 days ago in reply to Hirotsugu Kobayashi

TI__Intellectual 1060 points

Hi Hirotsugu-san,

It is not recommended to reduce the solder mask opening to 1.75 x1 .89mm. Because the thermal performance of the device depends on the solder mask opening.

Thanks,

Nitya

0 Hirotsugu Kobayashi 17 days ago in reply to Nityanand Hegde

Mastermind 8645 points

Hi Nitya,

However, it is necessary to create a board that is compatible with the two types of packages.
There is also an AN (SLMA002H) that says that the thermal resistance value does not change much if 50% of the power pad is solder covered.
We believe that the thermal characteristics will not change significantly even if the size is reduced slightly from the current version.

Best regards,

0 Nityanand Hegde 17 days ago in reply to Hirotsugu Kobayashi

TI__Intellectual 1060 points

Hi Hirotsugu-san,

Agreed on the App note information. However in order to fully leverage the thermal performances from POWERPAD package it is always suggested to solder the complete exposed pad to the printed circuit board.

As you might know, in datasheet we cannot suggest customer to reduce the exposed PAD open area to incorporate both packages.

If you want to move ahead with small open area, I recommend you validate the performance of the package/board by collecting empirical data for the device.

Thanks,
Nitya

0 Hirotsugu Kobayashi 17 days ago in reply to Nityanand Hegde

Mastermind 8645 points

Hi Nitya-san,

There are two types of packages, and unless a compatible design example is shown, it will cause trouble for many customers.
I would like you to either separate the part numbers or show a common design example.

Best regards,

0 Nityanand Hegde 16 days ago in reply to Hirotsugu Kobayashi

TI__Intellectual 1060 points

Hi Hirotsugu-san,

Creating a separate part numbers or show a common design example is beyond scope of the application team. You can bring up the packaging issues to customer service team as mentioned above.

Thanks,

Nitya

0 Hirotsugu Kobayashi 16 days ago in reply to Nityanand Hegde

Mastermind 8645 points

This may not be your team's role, but if I order from TI.com, which package will be shipped, and do I not know until it arrives?

0 Nityanand Hegde 15 days ago in reply to Hirotsugu Kobayashi

TI__Intellectual 1060 points

Hi Hirotsugu-san,

I am checking internally about this and get back to you in couple of days.

Thanks,

Nitya

+1 Nityanand Hegde 13 days ago in reply to Nityanand Hegde

TI__Intellectual 1060 points

Hi Hirotsugu-san,

I checked internally about this. Since the solder area coverage is greater than 70% with 1.75mm x 1.89mm solder mask opening. The ThetaJA should not change much. You can go ahead with 1.75mm x 1.89mm dimensions.

Thanks,

Nitya

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TPS54160A: New DGQ package