Hello expert,
Customer would like to achieve co-layout design for TPS533XX. As checked with datasheet, the difference between TPS533XX series is ROVP. May I know if we can connect ROVP to GND and finish co-layout design? Inductance and RTRIP will implement the highest value in order to meet TPS53355 design. Thanks a lot!!
Best regards,
Ann Lien
Gerold Dhanabalan - Online Design Tools
Ann Lien means a single PCB layout that will work for multiple devices.
The TPS53318 and TPS53319 datasheets are very clear on this subject. The Simplified Application Schematic on page 1 of the datasheet shows the pin connected to ground.
The Pin description for ROVP says that if unused it can be floated or connected to ground. (Connected to ground would be preferred)
And the Redundant OVP Section repeats the recommendation that the ROVP pin be shorted to ground if not used.
