LMG3410R050: Layout modeling problem of LMG3410

zoujiangyilang

Part Number: LMG3410R050

Hello,
Recently selected the LMG3410 device, and now encountered a problem in PCB design modeling.

In the data sheet, there is a large PAD on the bottom of the device.

I don’t know whether to build a complete large PAD according to the recommended 27 pages of the manual when building the PCB pad, or build the PAD into 10 small ones as recommended on page 35 of the manual. PAD?

The third page of the manual says that connecting the PAD to the source through the via is not necessary to connect the source to the source through the via in the middle layer.

It is not possible to directly connect the PAD to the source of 12-16 and 18-24 during modeling Connected?

Thank you.

over 4 years ago

0 Yichi Zhang. over 4 years ago

TI__Genius 16390 points

Hello Zou,

The thermal pad is what you see on page 27 as a large PAD, and page 35 is the pad with thermal vias, where the 10 pads you see is the thermal paste. You can download the CAD model from our website:https://www.ti.com/product/LMG3410R050#design-development##cad-cae-symbols. You can choose the one with thermal vias in place or the one without thermal vias if you want to implement different pattern.

Source and Pad are connected internally so you don't need to worry about that. Please refer to the PCB layout document of the daughter card to see the thermal via placement for thermal dissipation. https://www.ti.com/tool/LMG3410EVM-018#technicaldocuments

Please let me know if you have any other questions.

Regards,

0 zoujiangyilang over 4 years ago in reply to Yichi Zhang.

Genius 4560 points

Thank you, I will set up a large pad according to the reference, and then make some vias.

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LMG3410R050: Layout modeling problem of LMG3410