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Original question:

BQ51013: Questions about wireless reveicer and battery charging

BQ51013: Add heat sink on the top of the device

Jason Shen
Intellectual 1945 points
Part Number: BQ51013
Other Parts Discussed in Thread: BQ51020,

Dears

I have a customer asking for the stress can be add on the top of device, but there do not have a file mentioned it, so want to know if there have some suggestion about how to add a heat sink or how much stress can be add on the top? it is a BGA device.

Thanks 

Jun Shen 

  • 0
    TI__Guru 68226 points

    Hi Jun

    We have not applied heat sinks to BQ51013X BGA devices but do not recommended it.

    Some other options to look:

    1.) The BQ51020 is a larger BGA device with lower RDSon mosfets and higher efficiency.

    2.) The BQ51013B is available in both BGA and QFN versions.  QFN version has a thermal pad for improved cooling.