Customer needs a RoHS compliant assembly and usually uses a lead-free parts with SAC solder and reflow temp of 260 C max. The lead-free version of the TMS320VC5507 is not available to meet the schedule so they are considering purchasing SnPb devices (TMS320VC5507GBB) and reballing with SAC solder balls. The material content report for the SnPb version of the DSP says the max reflow temp is 220 C.
If they reball the GBB devices with SAC solder balls, can the package withstand the lead-free reflow temp of 260 C max?
