TMS320VC5510A: Starches and Excess solder spike in BGA Component - TMS320VC5510A

Hi manoj balakrishnan,

Please expect some delay in response due to Public Holiday in US.

Best Regards,
Aakash

Thanks for your reply . Pls let me know you feedback at the earliest. 

Looking forward for your valuable support on this. 

Manoj Balakrishnan

Good Morning TI team , 

Awaiting for your valuable support on this issue.

Hi Experts , 

Can you please support on this issue. 

Looking forward for your support Aakash Kedia

Hello,

Thank you for the patience. The package drawing at the end of the datasheet has the tolerance on the solder balls as 80um. Please see the below snapshot. Also are these parts handled or used in any way? We do not expect any issues as the reflow should take care of this.

Thanks,

Anita

Hi Anita Pratti

Thanks for your prompt response . 

Can you confirm starches found on the BGA PCB will not affect the functionality of the component and accept criteria for the same. 

Thank you.. 

Regards 

Manoj Balakrishnan

Hello Manoj,

Can you confirm any handling on these devices before these pictures were taken? The scratches could be flux from handling that would be burned off when the parts are mounted on PCB.

Thank you,

Anita

Hi Anita Pratti

These are unused parts and no pictures available with me. Just want you to confirm these solder spikes and scratches will not impact the component functionality . 

Based on your comments I will accept the parts for production. 

Thank you.. 

Regards 

Manoj Balakrishnan

Hi Anita Pratti

Can you please advise on this to accept the parts . 

Thank you and need your valuable support . 

Hi Anita , 

Thank you so much for your guidance. 

Hi Anita , 

Thank you so much for your guidance.