TDA3MA: TDA3MARBABFRQ1 Soldering Reflow Profile Peak Temperature

See application note: https://www.ti.com/lit/ug/spru811a/spru811a.pdf

In general, there are many factors involved in setting up and optimizing a reflow process on a manufacturing line.  These factors include, but are not isolated to, board layout, solder paste selection, reflow equipment setup, and interactions among these.  In fact, the board mount process has numerous variables.  Thus, reflow profiles typically must be optimized at the board manufacturing site for the specific board application.  In this process, solder paste suppliers and board manufacturers have the direct expertise required to develop the final solder reflow process for the actual product being built.

Texas Instruments provides to customers components that are used in board manufacturing processes.  All TI components are designed to meet the JEDEC standard J-STD-20 reflow guidelines for the device’s moisture sensitivity level. TI has generated application notes for general package types that contain general “recommended” solder profile information (see link above).  This reflow profile information is intended as a general guideline only.  Texas Instruments provides components designed to meet industry standards for reflow processes with the expectation that the appropriate reflow profile for a particular customer application will require optimization as described above.