66AK2G12: 66AK2G12, evaluation board , DDR3 termination

Hi .

I am using "66AK2G12 "device . As two device evaluation boards are available on TI platform by Mistral solutions.

1-- MS_TI_K2GEVM

2- MS_TI_k2GICE.

There is a difference in DDR3 termination section of board interfacing with SoC. In first board capacitors terminated with "DGND" 

While on other board DDR3 termination section capacitor terminated with "1.35V " net name as (VDDS_DDR_K2G). 

Please someone elaborate what is difference in both techniques  or which one is better.?

Schematic cutout of both are Attached below.