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TMS320VC5410A: Land diameter of package

g.f.
Guru 15510 points
Part Number: TMS320VC5410A

Hi,

My customer are using VC5410 and VC5416
They want to know the land diameter of GGU(144pin) and ZGU(144pin) package of above DSPs.

GGU and ZGU are Microstar BGA package and its 0.8mm pin pitch,
so I checked the following reference guide and it seems that
land diameter of 0.8mm pin pitch package are 0.38mm(SMD) or 0.35mm(NSMD).
www.tij.co.jp/.../ssyz015b.pdf
page.10 "Figure 8 Optimum Land Configurations"

So will the land diameters of the VC5410 and VC5416 GGU / ZGU packages
also be 0.38mm (SMD) or 0.35mm (NSMD)?

best regards,
g.f.

  • 0
    TI__Genius 9190 points

    Have they already ordered the parts?  The GGU and ZGU packages have been discontinued, but the replacement parts are essentially the same:

    https://www.ti.com/lit/pdf/sprz480

    The differences between the microstar and nfbga packages for the products are primarily mechanical (specifically a minor height difference).  The key parameters for the two packages are the same. The paths for the nfbga package substrate was designed to enable the parts to be considered datasheet equivalent (share the same datasheet; and power, ground and signal pins are all in the same X-Y locations).

     Board Layout Considerations:

    The nFBGA package provides the same X and Y dimensions as MicroStar BGA, and provides pin-to-pin and footprint compatibility. Minor adjustments in pick and place machine programming may be needed because of slight package and tray differences. The nfBGA package can solder to the Microstar BGA land pattern. However, there have been improved nFBGA PCB land pattern and stencil recommendations to achieve better soldering results after extensive testing and evaluation since the microstar package was developed. Please refer to the latest TI packaging drawing found in the latest TI device datasheet and datasheet addendum to review the package dimensions and latest PCB land pattern and stencil recommendation. For more details, check out this nFBGA application note 

  • 0 in reply to Jeff Culverhouse
    Guru 15510 points

    Hi,

    Thank you for the detail.

    Yes,they are going to order the part.
    Actually, I already told the customer that the nFBGA package provides the same X and Y dimensions as MicroStarBGA, and provides pin-to-pin and footprint compatibility.

    I don't know why but the customer want to know older package(GGU, ZGU) land size.
    I'm so sorry but can you answer to the following 2 questions.

    Q1.As I mention above, will the land diameters of the VC5410 and VC5416 GGU / ZGU packages
    also be 0.38mm (SMD) or 0.35mm (NSMD)?

    Q2.By the way, in "TMS320VC5410A MicroStar BGA Discontinued and Redesigned" which you attached,
    it seems that nfbga package land diameters is 0.4mm. It's longer than Microstar package,
    but as you said that the nfBGA package can solder to the Microstar BGA land pattern,
    is it okay to think that the difference of the land diameter won't be any problem ?

    best regards,
    g.f.

  • 0 in reply to Jeff Culverhouse
    Guru 15510 points

    Hi Jeff,

    Could you please give me reply to my previous post?

    best regards,
    g.f.