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TMDSEVM437X: Footprint dimensions

Part Number: TMDSEVM437X

Hello, 

I would like to ask for some help regarding the footprint of the AM437x processor. I have studied the layout design of the TMDSEVM437X and, after measuring various distances, concluded that each ball of the BGA is 0.28 mm x 0.28 mm. Is this right? Would this be ok provided that the recommended dimensions are 0.4 mm x 0.4 mm?

Thank you in advance. 

Best regards, 

Konstantinos. 

  • Hi,

    The AM437x nominal ball size is 0.42mm +/-0.06mm. The IPC recommended pad size reduction for this ball size is 20%, which would give a pad size of 0.336mm. However variation of +/-0.05mm is allowed for this pad size, which makes 0.28mm pad size absolutely acceptable.