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TMP235-Q1: FMD Failure Modes

Part Number: TMP235-Q1
Other Parts Discussed in Thread: LM50-Q1, , LM50

Hi team,

Based on the related thread, it seems that "VOUT short to VDD" is not considered when VDD and VOUT are not on the same side of the package.

LM50-Q1 is a device that we've already used and does include the "VOUT short to VDD" condition because both pins are on the same side in the SOT-23 package. 

When looking at the TMP23x-Q1 devices, "VOUT short to VDD" is no longer included, but the SOT-23 package still has the VDD and VOUT pins on the same side of the package.

Why does the TMP23x-Q1 FMD no longer include the "VOUT short to VDD" condition?



  • Jacob,

    Keep in mind that the Failure Mode distribution is based on engineering judgment. I don't believe it's accurate that the TMP235-Q1 device omits the "VOUT short to VDD" condition solely dependent on whether the pins are on the same side of the package. Though, it is a fair point that one package has this condition while the other doesn't.

    I believe the intent here is to cover the different failure modes of the Voltage output in which a "VOUT short to VDD" condition could technically be covered by the "VOUT functional out of spec vs temperature" statement.

    I wasn't involved in creating these two documents, but let me try and get some clarification on the TMP235-Q1 FMD for you..


  • Thanks Jalen! Appreciate the help and looking forward to hearing what you're able to find out!

  • Hi Jacob,

    Here's what I can tell you.

    These report are in older format. In the older format there was some inconsistency about the failure mode table and how to manage including die related failure modes together with package related failures and multiple package types.  

    There may have been a specific customer request about possibility of output shorting to VDD for the LM50 and a specific FMD line was added to the FMD table for that case.