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TMP1075: Design guide for TMP1075 consider about the heat source...

Peter Tseng
Genius 5770 points
Part Number: TMP1075

Hi Team,

Is there any design guide for TMP1075 and heat source?

Is there any recommended design for the contact method between TMP1075DGKT and the DUT?

Now customer use the bare copper of the PCB to contact the TMP1075 thermal pad with metal object of the DUT.

They also know the datasheet suggestion and want to know if there are other suggestions.

Thanks.

  • 0
    TI__Genius 10070 points

    Hi Peter,

    Thank you for posting to the Sensing forum.

    It is recommended to place the TMP1075 as close as possible to the heat source and to have a solid ground plane extending around both devices. The shared ground plane will help to create thermal equilibrium between the two devices.

    Another layout option is to place the TMP1075 on the back of the board, directly below the heat source. Adding vias to connect between the top and bottom layer ground will help to quickly transfer heat from one side of the board to the other.

    These layout recommendations and other details can be found in Section 3 of the PCB Guidelines for surface mount devices application report or the How to monitor board temperature application report.

    Best regards,
    Nicole