Hi sensors team,
my customer has the following problem:
As you can see in the upper left picture (screenshot F3 PIN Luftspalt.jpg) the solder joint at the upper end (component side) is cracked or not homogeneous.
About the product:
The heating-cooling cycles are as follows
60 - 110°C within ~5 seconds
110 - 60°C within ~6.5 seconds
these temperature cycles are run up to 100x per hour.
According to the paste manufacturer's info, above "stress" is not a problem, what about the BGA solder?
The BGA is soldered on a flex PCB.
As an attachment your data sheet for assignment.
A data sheet of the solder paste (SAC305) is also attached.