WL1805MOD: WL1805MOD Solder issue

user6294869

Part Number: WL1805MOD

The GND pads are in the middle of this WIFI module, after actual SMT solder reflow, we find void no those GND pad.

We try to adjust reflow profile and SMT stencil design, but can't get better result.

So do those voids will affect the reliability of WIFI function?

0 Seong Kim over 2 years ago

Hi user6294869,

It is recommended to have a solid GND connection to all GND pads under the module for a stable system and optimal thermal dissipation.

I'll reach out to our packaging team to inquire if there are recommendations to avoid this issue.

BR,

Seong

0 user6294869 over 2 years ago in reply to Seong Kim

Hello, Dear Seong:

Thanks your quick feedback. And yes, please see if your side has good method to solder the GND pad perfectly.

Expect to get news from you soon.

Thanks a lot again.

0 Seong Kim over 2 years ago in reply to user6294869

Will let you know as soon as I hear back.

0 Seong Kim over 2 years ago in reply to user6294869

user6294869,

Please provide PCVB layout, stencil design, solder paste information, and reflow profile for us to review.

I will send you a request to be friends on E2E. Please send me the requested items via direct message.

BR,

Seong

Wi-Fi forum