Dear sir,
We would like to know the possibility for TI to provide DIE wafer solutions for the following ICs.
INA333, OPA2364, ADC121C021.
Is it possible for you to provide free samples.
I am a scientist from CENTRAL MANUFACTURING TECHNOLOGY INSTITUTE, Bangalore, INDIA. Please provide contact details of suitable marketing engineer for this requirement of DIE form of ICs.
Thanks and Regards,
Raghu K